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As chips become more sophisticated high density fan-out wafer-level packaging, or FOWLP, has gained wider acceptance as a packaging solution. Read about its advantages and potential for the future in our latest blog post:
eSports, a form of competitive online gaming, has gone from niche to mainstream and continues to draw millions of viewers. Our latest blog post explores the technological innovations that made it possible, including improved internet speeds and processing power:
With plasma making up nearly 99.9% of the universe, Keren Kanarik, a senior technical director at Lam Research, explains the mysterious matter and explores how it's harnessed to fuel the modern electronics industry.
We’re proud to be participating in Ecochallenge.org’s Earth Month EcoChallenge, an online program that supports and encourages sustainable practices. Learn more:
We know that now more than ever, our employees, partners, local hospitals, and global communities need our support, which is why Lam Research has committed $25 Million towards short-term community needs, local hospital supplies, long-term relief efforts, employee benefit resources, and an employee double-matching campaign targeting COVID-19 related relief organizations. As this unprecedented and rapidly evolving situation continues to unfold, we will remain dedicated to the global geographies where we live and work. #LamCares, read more:
AI holds a lot of promise for the future of technology and innovation! Understand how it’s used in our daily lives as well as driving industries toward greater innovation in our latest blog post:
Hear from Richard A. Gottscho, Lam’s CTO, about the challenges that the semiconductor industry faces when it comes to utilizing big data for rapid technological evolution, in our latest blog post:
We’re excited to announce that we’ve been named a winner of Intel’s 2019 Preferred Quality Supplier award, which recognizes companies that relentlessly pursue excellence and conduct business with resolute professionalism. Learn more in our most recent blog post:
Today we announced the launch of a new plasma etch technology and system solution, Sense.i™, which revolutionizes the chipmaking process – read more in our blog:
In our latest blog post, we explore the transformations that AR and VR offer in areas such as classroom learning, home renovation and more:
